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A Semiconductor Device Primer, Fabrication of Semiconductor Devices Process flow for pixels on p-type substrates S. Holland, 9/22/94 Starting material: 5k Ωcm, 300 µm thick, p-type silicon (Wacker). After DI water rinse inspect for hydrophobic surface behavior on. Standard prediffusion clean with the addition of a dilute HF etch. This comprehensive volume provides an in-depth discussion of the fundamentals of. High dose implant stripping, and silicon and SiGe passivation. Surface and Colloidal Chemical Aspects of Wet Cleaning (Pages: 1-36).
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This comprehensive volume provides an in-depth discussion of the fundamentals of cleaning and surface conditioning of semiconductor applications such as high-k/metal gate cleaning, copper/low-k cleaning, high dose implant stripping, and silicon and SiGe passivation. The theory and fundamental physics associated with wet etching and wet cleaning is reviewed, plus the surface and colloidal aspects of wet processing. Formulation development practices and methodology are presented along with the applications for preventing copper corrosion, cleaning aluminum lines, and other sensitive layers. This is a must-have reference for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing.From the Reviews.' This handbook will be a valuable resource for many academic libraries. Many engineering librarians who work with a variety of programs (including, but not limited to Materials Engineering) should include this work in their collection.
My recommendation is to add this work to any collection that serves a campus with a materials/manufacturing/electrical/computer engineering programs and campuses with departments of physics and/or chemistry with large graduate-level enrollment.' — Randy Wallace, Department Head, Discovery Park Library, University of North Texas. Reinhardt is Principle Consultant at Cameo Consulting in San Jose, California. Currently, Karen works with start-up cleaning companies to develop their technology for acquisition. Prior to forming a consulting company, Karen was employed at Novellus Systems, AMD, and Cypress Semiconductor. She has published more than 30 technical publications, has been awarded seven patents, and is co-editor of Handbook of Silicon Wafer Cleaning Technology.Richard F.
Reidy (Ph.D., Penn State) is interim Chair and associate professor of Material Science and Engineering at the University of North Texas. He has conducted research in interconnect processing and characterization with over 60 technical publications and three patents. He is a member of the International Technology Roadmap for Semiconductors.